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The Philippines aims to double its semiconductor and electronics exports to a combined $110 billion by 2030
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Target is in line with the Philippine Semiconductor and Electronics Industry Roadmap
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S&E industry remains the Philippines’ top trade driver, accounting for nearly 60% of total export receipts
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Under plan, the country aims to transition from basic assembly to high-value “front-end” manufacturing and wafer fabrication by implementing policy reforms, training 128,000 professionals, and establishing three specialized national R&D laboratories
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Executive Secretary Recto called for strict monitoring, clear deadlines, and legislative support, emphasizing that addressing private sector needs like lower power costs and streamlined logistics is critical to preventing the plan from becoming mere “paper with ambition”
The Philippines aims to double its semiconductor and electronics (S&E) exports to a combined $110 billion by 2030, with the government committing full support to the private sector to achieve the targets.
During the fourth meeting of the Semiconductor and Electronics Industry Advisory Council (SEIAC) at Malacañang on March 23, the Department of Trade and Industry’s (DTI) Board of Investments (BOI) laid out plans to achieve goals set out in line with the Philippine Semiconductor and Electronics Industry (PSEI) Roadmap.
The target is to increase export figures to $70 billion in semiconductor shipments and $40 billion in other electronics within the next six years.
Executive Secretary Ralph Recto, who chairs the SEIAC, described the sector as a vital “employment leader and economic winner.”
The S&E industry currently serves as the backbone of Philippine trade, accounting for nearly 60% of the nation’s total export receipts and providing jobs to approximately three million Filipinos.
Recto emphasized the Marcos administration’s “firm commitment” to the plan, signaling that the government is moving beyond mere assembly toward high-value manufacturing and design.
A central pillar of the roadmap is a shift up the value chain. While the Philippines is already a major player in assembly and testing, the DTI is now targeting the “holy grail” of the industry: front-end manufacturing and wafer fabrication.
“The PSEI Roadmap gives us the framework to move up the value chain, from packaging into IC (integrated circuit) design and, eventually, wafer fabrication,” said DTI Secretary Ma. Cristina Roque. “The biggest driver of that transition is not just promotion but policy reform.”
To support this transition, the plan identifies several strategic interventions:
• The Talent Pipeline: A five-year workforce plan aims to train and upskill 128,000 semiconductor professionals to meet evolving technical demands.
• National Labs: The creation of up to three national laboratories, each specialized in distinct areas of R&D and fabrication capability.
• Regional Spotlight: Utilizing the Philippines’ 2026 ASEAN Chairmanship to market the country as the region’s emerging premier semiconductor hub.
Despite the optimism, officials are wary of the plan becoming another dusty government document.
Recto directed that implementation be monitored with “clear deadlines” and “assigned responsibilities,” noting that the roadmap requires significant legislative and budgetary support to become reality.
“Otherwise, it is just paper with ambition printed on it,” Recto said as quoted in a press release.
The roadmap was developed in coordination with industry stakeholders and research institutions, ensuring that the private sector’s needs — such as lower power costs and streamlined logistics — are addressed alongside the high-tech goals.
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